PCI Distributes Scholarship Funds for 2014-15 School Year
Posted on Wednesday, October 1, 2014
Powder Coating Institute (PCI) has announced its first scholarship
award recipients for students at University of Akron and North Dakota
State University. The Educational Fund is designated for the sole
purpose of soliciting, recommending
and approving scholarship awards to
students who are pursuing studies
in fields related to powder coatings.
They must be attending an educational
institution that offers studies related
to the powder coating industry such
as polymer science, manufacturing,
or engineering. Congratulations to
the following recipients who were
collectively awarded $9,000 in
scholarships:
- Subadhra Janardhanan;
University of Akron—The
Synthesis of Novel Powder
Coating Resins for Heat-Sensitive
Substrates. Advisor: Dr. Mark
Soucek
- Junren Lin; North Dakota State
University—Corrosion Protection
of Powder Coatings Using Metal
Rich Primers. Advisor: Dr. Dante
Battocchi
- Casey Orgon; North Dakota State
University—Electrochemical
Investigation of the Corrosion
Protection, Durability, and Effect
of Exposure on Powder/Metal-
Rich Coatings. Advisor: Dr. Dante
Battocchi
“One of PCI’s most important
missions is to ensure a sustainable,
well-trained future workforce as it
relates to powder coating technology,”
says Dave Lurie, PCI Executive
Director. “This year’s scholarship
recipients are on their way to creating
technology advancements of the
future—and we are proud to help
them get there!”
PCI’s Materials
Technology
Committee
administers
the
Scholarship
Program and works with
the executive director of PCI® and his
staff to promote and solicit scholarship
applications from students and
educational institutions. The Materials
Technology Committee awards
scholarships based on a set of criteria
established and approved by the PCI®
Board of Directors.
For more information, visit www.
powdercoating.org, or contact Kevin
Biller (kevinbiller@yahoo.com; 614-
354-1198) or Dave Lurie (dlurie@
powdercoating.org; 248-224-0752).